Brief Report from the Hannover Messe (after second day)

This is the fifth Hannover Fair for Beck IPC demonstrating IEC 61850 solutions. In 2010 Beck presented the first “IEC 61850 @ Chip”. Now – four years later – the market is looking for easy to use and reasonable priced IEC 60870-5-104, DNP3, IEC 61850, IEC 61400-25, … solutions!

The booth at the Hannover Messe in 2014 is quite small – but visited by many experts from experts users and manufacturers of many application domains from all over: Power transmission, distribution, renewable power, virtual power systems, building automation, asset management, …

… Beck IPC is partner of the Smart Grid Forum:

… the booth was visited by almost 100 experts during the first two days:

The key products are the com.tom devices that could be used to collect the process data, process them and communicate the results through IEC 60870-5-104, IEC 61850, IEC 61400-25, cloud portal, … Gateways between these protocols.

In case you want to see the most simple IEC 60870-5-104, IEC 61850, … in action, please visit the above booth C35/7 in Hall 13.

I look forward to meeting you at the above booth.